Sfoglia per Rivista IEEE TRANSACTIONS ON ELECTRON DEVICES
Quantum Conductance and Temperature Effects in Titanium Oxide-Based Memristive Devices
2024 Köymen, Itır; Carlo, Ivan De; Fretto, Matteo; Milano, Gianluca
Two-Terminal and Multi-Terminal Designs for Next-Generation Quantized Hall Resistance Standards: Contact Material and Geometry
2019 Kruskopf, Mattias; Rigosi, Albert F.; Panna, Alireza R.; Patel, Dinesh K.; Jin, Hanbyul; Marzano, Martina; Berilla, Michael; Newell, David B.; Elmquist, Randolph E.
Wafer Level Integration of 3-D Heat Sinks in Power ICs
2017 Para, Isabella; Marasso, S. L.; Perrone, D.; Gentile, MATTIA GIANFRANCO; Sanfilippo, C.; Richieri, Giovanni; Merlin, Luigi; Pugliese, D.; Cocuzza, M.; Ferrero, S.; Scaltrito, L.; Pirri, C. F.
Citazione | Data di pubblicazione | Autori | File |
---|---|---|---|
Quantum Conductance and Temperature Effects in Titanium Oxide-Based Memristive Devices / Köymen, Itır; Carlo, Ivan De; Fretto, Matteo; Milano, Gianluca. - In: IEEE TRANSACTIONS ON ELECTRON DEVICES. - ISSN 0018-9383. - (2024), pp. -7. [10.1109/ted.2024.3354868] | 2024 | Carlo, Ivan DeFretto, MatteoMilano, Gianluca + | Quantum_Conductance_and_Temperature_Effects_in_Titanium_Oxide-Based_Memristive_Devices.pdf |
Two-Terminal and Multi-Terminal Designs for Next-Generation Quantized Hall Resistance Standards: Contact Material and Geometry / Kruskopf, Mattias; Rigosi, Albert F.; Panna, Alireza R.; Patel, Dinesh K.; Jin, Hanbyul; Marzano, Martina; Berilla, Michael; Newell, David B.; Elmquist, Randolph E.. - In: IEEE TRANSACTIONS ON ELECTRON DEVICES. - ISSN 0018-9383. - 66:9(2019), pp. 3973-3977. [10.1109/TED.2019.2926684] | 2019 | Marzano, Martina + | Kruskopf2019_01.pdf |
Wafer Level Integration of 3-D Heat Sinks in Power ICs / Para, Isabella; Marasso, S. L.; Perrone, D.; Gentile, MATTIA GIANFRANCO; Sanfilippo, C.; Richieri, Giovanni; Merlin, Luigi; Pugliese, D.; Cocuzza, M.; Ferrero, S.; Scaltrito, L.; Pirri, C. F.. - In: IEEE TRANSACTIONS ON ELECTRON DEVICES. - ISSN 0018-9383. - 64:10(2017), pp. 4226-4232. [10.1109/TED.2017.2732733] | 2017 | Marasso, S. L.Pugliese, D.Cocuzza, M.Scaltrito, L.Pirri, C. F. + | IEEE 2017 Wafer Level.pdf |
Legenda icone
- file ad accesso aperto
- file disponibili sulla rete interna
- file disponibili agli utenti autorizzati
- file disponibili solo agli amministratori
- file sotto embargo
- nessun file disponibile