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EnglishComplex cryogenics still represents a strong limitation to the spread of Josephson voltage standards, and cryogenfree cooling is particularly suitable to simplify their operation. The main downsides of liquid-helium-free systems are related to the chip thermalization: Indeed, at low temperature, the heat transfer between the chip and the coldplate of a cryocooler in vacuum is strongly affected by the quality of the interfaces. In order to increase the thermal performances of cryocooled programmable Josephson standards, we devised and tested a special cryopackage: The chip is embedded into a sandwich structure with high-thermal-conductivity materials subject to a controlled mechanical pressure to reduce the thermal contact resistances. A thin sapphire lamina placed upon the chip allows the heat to be dissipated from the top, thus creating an additional path for the thermal flow. A special bridgelike system with a screw is used as a reproducible torque-to-force converter to exert known pressures to the sandwich. Furthermore, we analyzed the effect of thermal contraction to the actual pressure exerted on the chip, showing a nonnegligible increase when cooled down to cryogenic temperature that can be calculated and corrected for.
Thermal Performances of an Improved Package for Cryocooled Josephson Standards / Durandetto, Paolo; Monticone, Eugenio; Serazio, Danilo; Sosso, Andrea. - In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY. - ISSN 2156-3950. - 9:7(2019), pp. 1264-1270. [10.1109/TCPMT.2019.2901297]
| Titolo: | Thermal Performances of an Improved Package for Cryocooled Josephson Standards | |
| Autori: | ||
| Data di pubblicazione: | 2019 | |
| Rivista: | IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY | |
| Digital Object Identifier (DOI): | http://dx.doi.org/10.1109/TCPMT.2019.2901297 | |
| Abstract: | Complex cryogenics still represents a strong limitation to the spread of Josephson voltage standa...rds, and cryogenfree cooling is particularly suitable to simplify their operation. The main downsides of liquid-helium-free systems are related to the chip thermalization: Indeed, at low temperature, the heat transfer between the chip and the coldplate of a cryocooler in vacuum is strongly affected by the quality of the interfaces. In order to increase the thermal performances of cryocooled programmable Josephson standards, we devised and tested a special cryopackage: The chip is embedded into a sandwich structure with high-thermal-conductivity materials subject to a controlled mechanical pressure to reduce the thermal contact resistances. A thin sapphire lamina placed upon the chip allows the heat to be dissipated from the top, thus creating an additional path for the thermal flow. A special bridgelike system with a screw is used as a reproducible torque-to-force converter to exert known pressures to the sandwich. Furthermore, we analyzed the effect of thermal contraction to the actual pressure exerted on the chip, showing a nonnegligible increase when cooled down to cryogenic temperature that can be calculated and corrected for. | |
| Full-text (pubblici): | mixed | |
| Appare nelle tipologie: | 1.1 Articolo in rivista |
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